Presentations and Papers
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Non-Contact, Pad-less Measurement Technology and Test Structures for Characterization of Cross-Wafer and In-Die Product Variability
- J. S. Vickers, J. Galvier, W. Doedel,G. Steinbrueck, B. Borot, M. Gatefait, P. Gouraud, P. Gros, G. Johnson, M. Babazadeh, M. Pelella, and N. Pakdaman
Presented at SPIE
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Non-Contact, Pad-less Measurement Technology and Test Structures for Characterization of Cross-Wafer and In-Die Product Variability
- Gary Steinbrueck, James S. Vickers, Majid Babazadeh, Mario M. Pelella, and Nader Pakdaman
Presented at ICMTS
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In-line non-contact measurement of process induced in-die parametric variability
- James Vickers, Jean Galvier, Bertrand Borot, Wim Doedel, Gary Steinbrueck, Gloria Johnson,
Majid Babazadeh and Nader Pakdaman
Presented at ASCM